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Browse Prior Art Database

Method of Producing Thin-Film Wirings With Vias

IP.com Disclosure Number: IPCOM000034754D
Original Publication Date: 1989-Apr-01
Included in the Prior Art Database: 2005-Jan-27
Document File: 2 page(s) / 78K

Publishing Venue

IBM

Related People

Elsner, G: AUTHOR [+3]

Abstract

The proposed method permits producing thin-film wirings comprising vias that are easy to fabricate. These vias consist of polyimide-insulated Cu wire sections. The method allows fabricating the vias without resorting to vacuum or electrodeposition processes or lift-off technology. A foil 4, such as an Mo plate, provided with holes 3 in the area of the vias, is supported on carrier 1 (Fig. 1) by spacers 2. Cu wires 6, insulated by a polyimide layer 5, are threaded through holes 3 in foil 4. Then the top side of foil 4 is coated with polyimide 7 as a dielectric (Fig. 2). After precuring, projecting wire portions are cut off. In the next step (Fig. 3), the back side is coated with polyimide (Image Omitted) 8, followed by a curing step.

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Method of Producing Thin-Film Wirings With Vias

The proposed method permits producing thin-film wirings comprising vias that are easy to fabricate. These vias consist of polyimide-insulated Cu wire sections. The method allows fabricating the vias without resorting to vacuum or electrodeposition processes or lift-off technology. A foil 4, such as an Mo plate, provided with holes 3 in the area of the vias, is supported on carrier 1 (Fig. 1) by spacers 2. Cu wires 6, insulated by a polyimide layer 5, are threaded through holes 3 in foil 4. Then the top side of foil 4 is coated with polyimide 7 as a dielectric (Fig. 2). After precuring, projecting wire portions are cut off. In the next step (Fig. 3), the back side is coated with polyimide

(Image Omitted)

8, followed by a curing step. Finally, wires 6 and polyimide layers 7 and 8 on the front and the back side are polished to the desired dimensions in a chemical/mechanical step (Fig. 4). Subsequently, the desired thin-film wirings 9 are applied as usual to foil 4 which comprises vias conducting through wires 6 and which is insulated on both sides (Fig. 5).

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