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Browse Prior Art Database

Elastomeric Conduction Module

IP.com Disclosure Number: IPCOM000034859D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Chrysler, GM: AUTHOR [+3]

Abstract

A low-cost cooling design for high-powered modules which is easily manufacturable is achieved by a thin sheet of elastomeric material bonded to the inside of a hat or cap of an electronic module and to a spreader plate which is in contact with a chip. Heat from a chip is transferred to the spreader plate, across the spreader plate to the elastomeric sheet, and across the elastomeric sheet directly to the hat. The elastomeric material is of sufficient thickness and elasticity to take up non-uniformities in chip height and flatness. To achieve good thermal conduction across the elastomeric material, it is loaded with high conductivity particles, such as boron nitride, alumina, alumina nitride, or diamond "dust".

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Elastomeric Conduction Module

A low-cost cooling design for high-powered modules which is easily manufacturable is achieved by a thin sheet of elastomeric material bonded to the inside of a hat or cap of an electronic module and to a spreader plate which is in contact with a chip. Heat from a chip is transferred to the spreader plate, across the spreader plate to the elastomeric sheet, and across the elastomeric sheet directly to the hat. The elastomeric material is of sufficient thickness and elasticity to take up non-uniformities in chip height and flatness. To achieve good thermal conduction across the elastomeric material, it is loaded with high conductivity particles, such as boron nitride, alumina, alumina nitride, or diamond "dust". The elastomeric sheet and its particles are electrically non-conductive, allowing the spreader plate to be made of an excellent thermal conductor, such as copper.

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