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Directional Heat Transfer Pallet for Large Ceramic Circuit Modules

IP.com Disclosure Number: IPCOM000034863D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-27
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Fischer, GR: AUTHOR [+2]

Abstract

Disclosed is a pallet 1 to be used in the processing of large ceramic modules 2 in chip join furnaces 3 or equivalent type furnaces. The graphite pallet 1 is designed to provide the greatest heat conduction through the center 4 of the pallet while in a furnace 3. This causes an increase in temperature to the center of a large ceramic module 2. The effect of this design are to reduce the temperature gradient across the module to less than 5oC and to provide a reduction in dwell time. The outer module pins 5 are in contact with the pallet to insure pin stability while on the furnace belt 6. As the module pallet leaves the "spike zone", the directional heat transfer pallet assists in cooling down the ceramic module. Heat energy is rapidly dissipated, thereby cool down and dwell times meet the typical processing specifications.

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Directional Heat Transfer Pallet for Large Ceramic Circuit Modules

Disclosed is a pallet 1 to be used in the processing of large ceramic modules 2 in chip join furnaces 3 or equivalent type furnaces. The graphite pallet 1 is designed to provide the greatest heat conduction through the center 4 of the pallet while in a furnace 3. This causes an increase in temperature to the center of a large ceramic module 2. The effect of this design are to reduce the temperature gradient across the module to less than 5oC and to provide a reduction in dwell time. The outer module pins 5 are in contact with the pallet to insure pin stability while on the furnace belt 6. As the module pallet leaves the "spike zone", the directional heat transfer pallet assists in cooling down the ceramic module. Heat energy is rapidly dissipated, thereby cool down and dwell times meet the typical processing specifications.

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