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Vortex Generator for Circuit Card With Air-Cooled Components

IP.com Disclosure Number: IPCOM000034866D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Agonafer, D: AUTHOR [+3]

Abstract

In a system in which air is blown across the surface of a card that carries heat-producing components, vanes are located along the upstream edge of the card to produce "wing-tip" vortex trails in the air flowing over the components. The air pressure is higher on the upstream side of a vane than on the downstream side, and vortex trails are formed as air flows across the pressure difference. As is known, the vortex trails break up the boundary layer of air that otherwise presents a high impedance in the path of heat transfer from a component to the air stream. A vane has a thin rectangular shape. Vanes are mounted on at a slight angle to the general direction of air flow.

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Vortex Generator for Circuit Card With Air-Cooled Components

In a system in which air is blown across the surface of a card that carries heat- producing components, vanes are located along the upstream edge of the card to produce "wing-tip" vortex trails in the air flowing over the components. The air pressure is higher on the upstream side of a vane than on the downstream side, and vortex trails are formed as air flows across the pressure difference. As is known, the vortex trails break up the boundary layer of air that otherwise presents a high impedance in the path of heat transfer from a component to the air stream. A vane has a thin rectangular shape. Vanes are mounted on at a slight angle to the general direction of air flow. The angle of the vanes alternates as seen from above the card so that pairs of adjacent vanes have their upstream edges wide apart and their downstream edges close together. In one implementation, the vanes are mounted along the upstream edge of the card. In an alternative implementation, a vane is formed as part of the cap of a module and these modules are located along the upstream edge of the card.

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