Browse Prior Art Database

Ceramic Lid Piercing Tool

IP.com Disclosure Number: IPCOM000035074D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Parker, DE: AUTHOR [+3]

Abstract

The ceramic lids of very large-scale integration packages can be safely and accurately punctured with a limited travel punch prior to heating the package for rework and thereby avoid internal gas pressure build-up.

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Ceramic Lid Piercing Tool

The ceramic lids of very large-scale integration packages can be safely and accurately punctured with a limited travel punch prior to heating the package for rework and thereby avoid internal gas pressure build-up.

In the figure, base 1 is formed with holes 2 that accept the connector pins of a ceramic circuit package (not shown). Other locator stops 3 in openings 4 can be used for other types of packages to aid in accurately positioning and retaining the packages. Fixed punch guide 5, in the configuration of an inverted U-shape is attached to base 1 and formed with hole 6 through which punch 7 moves to contact the package. The punch carries an adjusting collar 8 that engages shim 9, 0.004-inch thick, or the top of guide 5 when the shim is removed.

In operation, a sealed ceramic circuit package is positioned on base 1 beneath guide 5 and punch 7 inserted through hole 6. Shim 9 is placed under collar 8 and the collar adjusted until it makes contact with the package lid. The shim is then removed and the punch driven downward against guide 5. This produces a hole of approximately 0.020 inch diameter with a small amount of ceramic debris. The lid can then be removed safely upon heating the ceramic package.

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