Browse Prior Art Database

Leveling Technique for Pads of Predeposited Solder

IP.com Disclosure Number: IPCOM000035088D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 3 page(s) / 63K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR [+2]

Abstract

Unwanted or inadvertent shifting of electronic components that are surface-mounted by reflow on pads of predeposited solder can be reduced or eliminated by subjecting the solder-coated pads to mill rolling prior to reflow to reform the solder caps to a uniform height. (Image Omitted)

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Leveling Technique for Pads of Predeposited Solder

Unwanted or inadvertent shifting of electronic components that are surface- mounted by reflow on pads of predeposited solder can be reduced or eliminated by subjecting the solder-coated pads to mill rolling prior to reflow to reform the solder caps to a uniform height.

(Image Omitted)

A pair of mill rollers with adjustable separation to accept circuit boards of variable thicknesses (see Fig. 1) efficiently produces uniform heights of irregular pad elevations for component mounting and stabilizes their location. Fig. 2 shows irregular pad elevations. Fig. 3 shows the uniform pad elevations after rolling in accordance.

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