Browse Prior Art Database

Self-Loaded Plates for Chip Cooling

IP.com Disclosure Number: IPCOM000035135D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Kok, P: AUTHOR [+2]

Abstract

This article proposes the use of integral spring-loaded plates to provide a conduction path for cooling of semiconductor chips. The plates provide a low resistance thermal path from the back of a chip to the hat which seals the chip; the springs compensate for chip tilt.

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Self-Loaded Plates for Chip Cooling

This article proposes the use of integral spring-loaded plates to provide a conduction path for cooling of semiconductor chips. The plates provide a low resistance thermal path from the back of a chip to the hat which seals the chip; the springs compensate for chip tilt.

Referring to Fig. 1, the proposed plate is constructed with spring fingers 2 integral to its design. The plate is located between the chip 3 and the hat 4 so that the deflected fingers provide a firm contact of the plate against the chip and hat. An assembly of multiple plates are stacked between the chip 3 and the hat 4, as shown in Fig. 2. The plates are alternated so that the fingers 2 impinge against the chip in one instance and against the hat in the other. A spring clip 5 holds the plates securely within the cavity between the chip and hat.

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