Browse Prior Art Database

High Speed Assembly Process for Double-Sided Surface Mount Attach

IP.com Disclosure Number: IPCOM000035167D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Woychik, CG: AUTHOR

Abstract

Disclosed is an assembly process that utilizes a template to place front and backside surface mount components.

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High Speed Assembly Process for Double-Sided Surface Mount Attach

Disclosed is an assembly process that utilizes a template to place front and backside surface mount components.

Currently it is very difficult to assemble large volumes of double-sided surface mount cards since the time required to accurately place all the components is relatively long for high accuracy placement. High speed placement equipment is just not available. By incorporating a template, as shown in Fig. 1, it becomes possible to accurately place all the surface mount components on one side of the card.

In this application the backside of the card is populated first. Solder paste is screened on the card pads and then the template is placed on the card using the fixturing holes on the panel to align the card pads with the openings on the template. A nest can then be used to hold the components in place (eliminating the need for epoxy to hold the backside components in place during reflow). The card is then

(Image Omitted)

flipped for topside assembly. Here the same procedure is again used to screen the topside with solder paste, and use the template to place the components accurately on their respective sites. The entire assembly is then run through the vapor phase reflow furnace.

By employing the use of a template to place all of the surface mount components, it becomes possible to gang place all of the components (low precision placement equipment) onto the card with high component placeme...