Browse Prior Art Database

Burn-In Methodology for TAB Using Separate Signal Carrier Tape

IP.com Disclosure Number: IPCOM000035220D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 113K

Publishing Venue

IBM

Related People

Katyl, RH: AUTHOR [+2]

Abstract

Disclosed is a method for burning-in chips on continuous sections of Tape Automated Bonding (TAB) tape. Individual TAB frames do not have to be handled. Operations are less labor-intensive because more automated handling can be used. A second "bus" tape provides parallel connection chips on individual TAB frames to electrical signals from a tester/exerciser. Thermocompression bonds between leads on both tapes provide the connection method.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 60% of the total text.

Page 1 of 2

Burn-In Methodology for TAB Using Separate Signal Carrier Tape

Disclosed is a method for burning-in chips on continuous sections of Tape Automated Bonding (TAB) tape. Individual TAB frames do not have to be handled. Operations are less labor-intensive because more automated handling can be used. A second "bus" tape provides parallel connection chips on individual TAB frames to electrical signals from a tester/exerciser. Thermocompression bonds between leads on both tapes provide the connection method.

A second tape, called the "bus" tape is used to distribute the signals to groups of chips on the chip carrier tape (Fig. 1). The bus tape is applied after chip bond and encapsulation (Fig. 2). Windows placed in the dielectric of both tapes are aligned over one another by registration throughout the sprocket holes. Metal lines to be connected from one tape to another cross over at the windows, forming "cross-point" structures. These metal lines are thermocompression bonded together to form the electrical signals needed for burn-in.

(Image Omitted)

For the burn-in operation, the bonded or doubled tapes are wrapped around a burn-in fixture assembly for placement into the burn-in chamber. The burn-in electrical driver/exerciser connects to a special set of pads on the bus tape. The driver connects to groups of chips, typically 20-50. Groups are electrically isolated from one another by cutting through the bus wiring near the connection frame. It is necessary to burn-in...