Browse Prior Art Database

Improvements to Reactive Ion Etching Equipment

IP.com Disclosure Number: IPCOM000035412D
Original Publication Date: 1989-Jul-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Court, C: AUTHOR [+2]

Abstract

This article presents a description of mechanical's parts which improves plasma etching (quality and reliability) with standard plasma etching equipment used in Failure Analysis laboratory to remove passivation layers on semiconductor. Typical equipment is composed of two chambers (one master and one slave), driven by a common electronic circuitry. Each chamber is dedicated to a specific part of the process: - the master's role is to remove nitride silicon or quartz (pure SiO2), and - the slave's role is to remove polyimide.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 73% of the total text.

Page 1 of 2

Improvements to Reactive Ion Etching Equipment

This article presents a description of mechanical's parts which improves plasma etching (quality and reliability) with standard plasma etching equipment used in Failure Analysis laboratory to remove passivation layers on semiconductor. Typical equipment is composed of two chambers (one master and one slave), driven by a common electronic circuitry. Each chamber is dedicated to a specific part of the process: - the master's role is to remove nitride silicon or quartz (pure SiO2), and - the slave's role is to remove polyimide.

These two chambers are made of quartz. The ionized gas used to remove the nitride or quartz passivation layers are fluor gases (SF6 and CF4).

A disadvantage is the etching of the PYREX* chamber which becomes opaque, inducing no visibility inside chamber and misalignment of the laser spot on chip used to control the etching.

The new chamber to replace the PYREX master slave is made of inoxidizable steel and presents many parts used to place the sample, to see inside it or to place control tools for temperature, pressure, etc., measuring.

While the previous chamber could be moved, this one is fixed; it is not necessary to raise the chamber to put the sample inside. This presents the advantage of keeping the laser fixed on the chamber and ensuring the repeatability of the laser spots pointing on chip. To perform the repeatability of the alignment of the laser beam on chip, it is necessary to put the...