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Browse Prior Art Database

Wet ETCHANT for Borosilicate Type Glasses

IP.com Disclosure Number: IPCOM000035706D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Powell, JL: AUTHOR

Abstract

In packaging technology the ability to wet etch sintered and evaporated borosilicate glasses at room temperature in the absence of insoluble residue from etched glass byproducts is of prime importance.

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This is the abbreviated version, containing approximately 100% of the total text.

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Wet ETCHANT for Borosilicate Type Glasses

In packaging technology the ability to wet etch sintered and evaporated borosilicate glasses at room temperature in the absence of insoluble residue from etched glass byproducts is of prime importance.

The following etchant solutions have been found effective for etching tapered openings suitable for the purpose of interconnecting metallurgical lines in borosilicate type glass layers of thicknesses on the order of 10 microns.
A) HF 17.65 - 35.30% (49% conc.)

HNO3 11.76 - 23.50% (70% conc.)

DI H2O 41.20 - 70.59%
B) HF 17.65 - 35.30% (49% conc.)

H3PO4 11.76 - 23.50% (86.2% conc.)

DI H2O 41.20 - 70.59%
C) HF 17.65 - 35.30% (49% conc.)

HOAc 11.76 - 23.50% (99.8% conc.)

DI H2O 41.20 - 70.59%

THE PREFERRED ETCHANT FOR GLASS DIELECTRICS 35.3% HF

23.5% HOAc

41.2% DI H2O.

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