Browse Prior Art Database

Array Manifolds for Multi-Chip-Module Cooling Systems

IP.com Disclosure Number: IPCOM000035754D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 71K

Publishing Venue

IBM

Related People

Flint, EB: AUTHOR [+2]

Abstract

The array manifold described here provides parallel paths to distribute and collect coolant from each chip on a multi-chip module. The coolant flow-rate of each chip can be adjusted independently according to the chip power and its operating temperature.

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Array Manifolds for Multi-Chip-Module Cooling Systems

The array manifold described here provides parallel paths to distribute and collect coolant from each chip on a multi-chip module. The coolant flow-rate of each chip can be adjusted independently according to the chip power and its operating temperature.

The array manifold shown in Fig. 1 has two box-like structures. The small box called the supply manifold 10 is placed at the center of the large box return manifold 12 and is used to distribute coolant to each chip. The coolant is sent to the supply manifold via the inlet

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port 14 (at the center of the outer cover 16). Return manifold 12 collects coolant from each chip. The warm coolant then flows through the passages between the walls of the supply and return manifolds to the outlet port 18. A supply-manifold cover 20 and a support plate 22 are also provided. As will be apparent from Fig. 2, support plate 22 supports flow-control pins which are used to regulate coolant flow to individual chips of the multi-chip module 24.

The path of the coolant flow is shown in Fig. 2, in which a cross- sectional view of a typical array manifold of a multi-chip module 26 is illustrated. The number of chips 28 that the present array manifold can serve has no limit. The connections between the supply/return manifolds and the chip manifolds (which are bonded to heat exchangers) are provided by the compliant coaxial tubes in which the coolant is supplied through t...