Browse Prior Art Database

Disk File Head Lead Connection

IP.com Disclosure Number: IPCOM000035816D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 89K

Publishing Venue

IBM

Related People

Bosier, MH: AUTHOR [+4]

Abstract

In a disk file, multiple miniature wires from a magnetic head have to be connected to a multi-conductor flexible printed circuit. An intermediate flexible circuit is disclosed to one end of which the head wires are bonded to tabs. The intermediate circuit acts as an expander to enable a more robust flexible circuit to be connected to its other end. The assembly is capable of automatic assembly.

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Disk File Head Lead Connection

In a disk file, multiple miniature wires from a magnetic head have to be connected to a multi-conductor flexible printed circuit. An intermediate flexible circuit is disclosed to one end of which the head wires are bonded to tabs. The intermediate circuit acts as an expander to enable a more robust flexible circuit to be connected to its other end. The assembly is capable of automatic assembly.

As illustrated in Fig. 1 multiwire cables 1 from a magnetic disk head are fixed to head arm 2. An intermediate flexible circuit 3 with tabs 4 is fixed to head arm
2. Cable wires 5 are bonded to appropriate tabs 4 on circuit 3. Expander section 6 provides wider spacing of conductors 8 connected to tabs 9. Tabs 10 on a more robust flexible printed circuit are wire bonded to respective tabs 9. In manufacture, first the intermediate circuit 3 is fixed to arm 2 and connection to tabs 4 made to form a head/arm assembly. Later the robust printed circuit is located by machine vision and connection made between tabs 9 and 10.

(Image Omitted)

Fig. 2 illustrates a modification of Fig. 1 with the same numerals, where appropriate, expander section 6 enables wires 5 to be spaced apart and bonded to tabs 4. Buried conductors 11 connect tabs 4 to tabs 9. A more robust flexible printed circuit (not shown) is located above tabs 9 and connect by ultrasonic bonding.

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