Browse Prior Art Database

Acetic Acid Spray Rinse for Removing Developed Resist Residuals From a Wafer Surface

IP.com Disclosure Number: IPCOM000035838D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Baker, RK: AUTHOR [+3]

Abstract

Development of exposed semiconductor resist by a base leaves residuals on the surface of silicon wafers. A dilute (0.5%) acid spray rinse between two normal deionized water (DI) rinses is completely effective in dissolving these residuals.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 62% of the total text.

Page 1 of 2

Acetic Acid Spray Rinse for Removing Developed Resist Residuals From a Wafer Surface

Development of exposed semiconductor resist by a base leaves residuals on the surface of silicon wafers. A dilute (0.5%) acid spray rinse between two normal deionized water (DI) rinses is completely effective in dissolving these residuals.

Referring to the figure, a perforated spray rinse tube is installed in the bottom of the first of two DI water rinse tanks following the base, e.g., potassium hydroxide resist develop tank. The spray rinse tube provides a method by which a dilute acid solution, e.g., acetic is brought into contact with the wafer surface during the first DI rinse cycle. At a pre-determined time in the wafer rinse cycle, the acid is injected into, and mixes with, a running flow of DI water just before the DI water enters the rinse tank. This dilute acid solution enters the tank through a pipe that is connected to a spray rinse tube, and brought to the wafer surface in a high shear environment, allowing the dilute acid to react with and completely remove acid soluble contaminants remaining on the wafer surface.

A high fluid shear environment is developed by using specifically sized and divergent holes uniquely spaced along the length of the spray rinse tube. The spacing ensures that at least two of the divergent holes spray the dilute acid in between each wafer in a wafer boat, thus ensuring complete coverage of the wafer surface. The spray rinse tube is fabricate...