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Thin Film Read/Write/Erase Head

IP.com Disclosure Number: IPCOM000035841D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 57K

Publishing Venue

IBM

Related People

Argumedo, A: AUTHOR [+4]

Abstract

A read/write/erase magnetic head can be produced by separately forming an erase and a read/write chip row and then bonding the rows together with a closure before contouring and separating into individual elements. Rows of erase and read/write functions can also be deposited onto opposite sides of a chip or separately deposited onto thin wafers and bonded to opposite sides of a support with closures then bonded to protect the rows before the contouring and separating steps.

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Thin Film Read/Write/Erase Head

A read/write/erase magnetic head can be produced by separately forming an erase and a read/write chip row and then bonding the rows together with a closure before contouring and separating into individual elements. Rows of erase and read/write functions can also be deposited onto opposite sides of a chip or separately deposited onto thin wafers and bonded to opposite sides of a support with closures then bonded to protect the rows before the contouring and separating steps.

As shown in Figs. 1 and 2, a plurality of thin film erase function elements 10 are deposited onto a substrate 11 to form an erase chip row 12. Likewise, a plurality of read/write elements 13 are deposited onto a substrate 14 to form a read/write chip row 15. A closure 16 completes the row of heads. The substrate 11 and 12 and the closure 16 may be a ferrite material or, if thin film elements only are used to form the gaps, a non-magnetic ceramic, such as alumina, may be used. The substrates and closures are bonded together and the rows can be contoured and then separated to form a head 17, such as is shown in Fig. 2. The head 17 comprises an erase portion 18, a read/write portion 19 and a closure portion 20. Suitable conductor pads permit electrical connection to the elements.

Referring to Fig. 3, a head 21 includes an erase element and a read/write element bonded or deposited onto a substrate 24. Closures 25 and 26 are bonded over the elements to complete the h...