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Process for Direct Printing of High-Resolution Metal Patterns

IP.com Disclosure Number: IPCOM000035865D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 4 page(s) / 107K

Publishing Venue

IBM

Related People

Acocella, J: AUTHOR [+6]

Abstract

A process is described for generating high-resolution metallization patterns on insulating and conducting materials which is applicable to the fabrication of microelectronic device structures. It is particularly useful in depositing circuit metallurgy on glass, ceramic, polymer and composite dielectric layers for first and second level packaging applications.

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Process for Direct Printing of High-Resolution Metal Patterns

A process is described for generating high-resolution metallization patterns on insulating and conducting materials which is applicable to the fabrication of microelectronic device structures. It is particularly useful in depositing circuit metallurgy on glass, ceramic, polymer and composite dielectric layers for first and second level packaging applications.

The process is based in essence on the direct contact-transfer of pre-defined metal patterns from a silicon printing plate onto another substrate surface. In practice the desired pattern is first defined and etched in an oxidized silicon wafer, the wafer is next immersed in an electroplating bath to deposit metal in the etched pattern only, and finally the metallurgy is directly contact-transferred onto the desired substrate surface. Pattern transfer is essentially a printing process which is performed by lamination and separation of the wafer and is strongly dependent on the ability of the metal to separate from the silicon plate and preferentially adhere to the substrate surface.

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The silicon printing plate is in effect a permanently patterned silicon wafer which serves as an electrically conducting cathode as well as a carrier for the electrodeposited metallurgy. The metallurgy is a replica of the surface pattern that is produced by selective deposition of metal in the unmasked regions of the silicon surface. Electrodeposition here is similar in principle to the process of electroforming or electrotyping.

High-resolution metal patterns can therefore be selectively deposited and transferred repeatedly from the same wafer in a manner similar to the operation of a printing press. In this respect metal deposition on a patterned silicon printing plate corresponds to the application of ink on a conventional printing plate. The main process steps which illustrate the concept are clearly shown in Fig. 1 and the cycling operation between electrodeposition and printing is sketched in Fig. 2.

Silicon printing differs from the known decal...