Browse Prior Art Database

Thin Film and Ferrite Magnetic Head

IP.com Disclosure Number: IPCOM000035869D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Lis, D: AUTHOR [+3]

Abstract

A read/write and erase magnetic head for flexible media can be made using thin film batch processing for the read/write portion, combined with a ferrite block for the erase function. Different adhesives fasten the blocks together, one for the gap bond and a second for the structure bond. Stress is thereby lowered.

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Thin Film and Ferrite Magnetic Head

A read/write and erase magnetic head for flexible media can be made using thin film batch processing for the read/write portion, combined with a ferrite block for the erase function. Different adhesives fasten the blocks together, one for the gap bond and a second for the structure bond. Stress is thereby lowered.

As shown in the figures, the head 10 includes a block of ferrite 11 to which is bonded a read/write section 12, and an erase ferrite block closure 13. Winding 14 activates the erase function. The read and write functions are formed within the read/write section 12 by standard batch fabricating procedures using either a magnetoresistive read element and an inductive write element or a single read/write thin film inductive element on separate thin film inductive elements for reading and writing. The read/write section 12 can be formed on a ferrite block such that it completes the magnetic path with the ferrite block 11 and the erase ferrite block closure 13 for a total width erase. The read/write gap is much narrower since the gap covers only a portion of the read/write section 12.

To bond the pieces together, a two-stage bonding process is used. The read/write section 12 and the erase ferrite block closure 13 are structurally bonded to the ferrite block 11 to provide a structure that can withstand the subsequent machining operations, such as sawing and contouring. A high molecular weight adhesive is best at high applie...