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Decal Enhancements for Tape Automated Bonding

IP.com Disclosure Number: IPCOM000035875D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 3 page(s) / 104K

Publishing Venue

IBM

Related People

Honeycutt, JO: AUTHOR [+2]

Abstract

The decal shown in Fig. 1 can be modified to allow it to be bonded by the Tape Automated Bonding (TAB) thermode technique. Two proposed designs are described as follows: (Image Omitted)

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Decal Enhancements for Tape Automated Bonding

The decal shown in Fig. 1 can be modified to allow it to be bonded by the Tape Automated Bonding (TAB) thermode technique. Two proposed designs are described as follows:

(Image Omitted)

1. The design shown in Fig. 2 can be achieved by etching a window in the polyimide film to expose the metal outer leads. The decal will then be gang- bonded directly onto the board, as shown in Fig. 3.

2. The design shown in Fig. 4 can be achieved with the addition of a stiffener on the polyimide. The stiffener will hold the polyimide film tightly to provide support for the leads during the excise step. The decal will then be gang-bonded to the board by heating through the polyimide film as shown in Fig. 5.

(Image Omitted)

The designs described above will also eliminate the need for a stress relieve cycle after the decal is bonded.

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