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Masking Critical Areas During Metalization Using Polyethylene Thick Films

IP.com Disclosure Number: IPCOM000035883D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Kendall, RA: AUTHOR

Abstract

During evaporative deposition of metal it is sometimes necessary to cover portions of the substrate or module to prevent deposition of covered areas. This is done typically using fabricated shadow-masks and covers or by taping. Those methods expose the work to the risk of abrasive damage or adhesive residue.

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Masking Critical Areas During Metalization Using Polyethylene Thick Films

During evaporative deposition of metal it is sometimes necessary to cover portions of the substrate or module to prevent deposition of covered areas. This is done typically using fabricated shadow-masks and covers or by taping. Those methods expose the work to the risk of abrasive damage or adhesive residue.

This technique is suitable for masking while depositing evaporated metals (or other materials) on the desired surfaces of a substrate or component (for example, wafers, photomasks, optical components, and process tooling). Critical areas are covered during the deposition process with a mask formed by applying a thick film of polyethylene of the type used as a "cling-film" in the packaging industry. This material is typically supplied in a clear state with a thickness of approximately 0.5 mil. The film is inexpensive and simple to work with. When applied to the desired surfaces and smoothed and trimmed by hand, the polyethylene film has no tendency to lift or peel in high-vacuum conditions typically found in evaporators. At the completion of the process the film is simply peeled off with no visible residues, as polyethylene films require no adhesives.

Use of the film eliminates the need to fabricate shadow-masks or covers. The film conforms to compound curves and is suitable for use on many different substrates. In addition, the film is non-abrasive, leaves no adhesive residue, is easily...