Browse Prior Art Database

EMI/ESD Depletion Strip

IP.com Disclosure Number: IPCOM000035920D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 77K

Publishing Venue

IBM

Related People

Albrechta, J: AUTHOR [+3]

Abstract

This is a method of providing an Electro-Magnetic Interference/ElectroStatic Discharge (EMI/ESD) ground depletion path. The EMI/ESD depletion strip C is a spring stainless steel stock member that is spot welded to the base G which, in turn, is fastened to the stiffener/ planar assembly D, and grounded to the picture frame E, which, in turn, is grounded to the machine frame.

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EMI/ESD Depletion Strip

This is a method of providing an Electro-Magnetic Interference/ElectroStatic Discharge (EMI/ESD) ground depletion path. The EMI/ESD depletion strip C is a spring stainless steel stock member that is spot welded to the base G which, in turn, is fastened to the stiffener/ planar assembly D, and grounded to the picture frame E, which, in turn, is grounded to the machine frame.

As a card assembly A or B is inserted into the Zero Insertion Force (ZIF) connector handle F, the metal cover skirt H physically interferes with a finger C of the depletion strip, draining the static charge. As the assembly traverses into the connector and the card assembly seats, a consistent force of the finger remains applied to the skirt, thus providing a ground path during machine operation.

The advantages of this method are as follows:
1. Provides individual card assembly grounding for static

buildup.
2. Provides individual card assembly grounding for

component radio frequency emission.
3. Can be used in new machine build as well as field

upgrades to comply with FCC and UDE regulations.

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