Browse Prior Art Database

Thermal Enhancement Plate

IP.com Disclosure Number: IPCOM000035953D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Johnson, EA: AUTHOR [+3]

Abstract

Disclosed is a process to thermally enhance an LSI silicon chip in a module assembly. Increased density of semiconductors per unit area and larger chip sizes continue to increase the power dissipation requirement for a module assembly. It is proposed that a thermal spreading plate be permanently attached to the inactive side of the silicon chip.

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Thermal Enhancement Plate

Disclosed is a process to thermally enhance an LSI silicon chip in a module assembly. Increased density of semiconductors per unit area and larger chip sizes continue to increase the power dissipation requirement for a module assembly. It is proposed that a thermal spreading plate be permanently attached to the inactive side of the silicon chip.

The thermal enhancement plate is a simple device that is used to "enhance" heat transfer performance of either existing or new microelectronic silicon chip- cooling designs. It consists of a highly conductive material with thermal expansion characteristics similar to silicon, e.g., molybdenum, tungsten, or aluminum nitride, and has

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cross-sectional dimensions larger than the chip that is to be cooled. Bi-metallic or sandwich compositions could be utilized. The plate is thin and flexible and has square or rectangular geometry to maximize thermal performance. It is attached to the top (inactive) side of a chip with a thin layer of solder or conductive epoxy. The thermal enhancement plate is shown in Fig. 1, where it is incorporated on a single-chip module. Multi-chip applications are possible. The plate may be composed of a single material or a clad metallic to increase efficiency (see Fig. 1b). In addition, the plate may be formed, as shown in Fig. 2, to provide direct contact with the cap. In this case, the formed recess also provides a reservoir for a secondary conductive material...