Browse Prior Art Database

Metal Frame for Passive Super Chip Module

IP.com Disclosure Number: IPCOM000035969D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 84K

Publishing Venue

IBM

Related People

Gruber, HW: AUTHOR [+4]

Abstract

A metal frame is described which provides three functions in conjunction with the passive super chip (PSC) module. 1. It is used to position the PSC on the signal plane of the module pin plate. 2. It is used to mechanically hold down the PSC on the spacer and the signal plane to prevent vibration and floating prior to and during wire bonding. 3. It is used to ground the PSC.

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Metal Frame for Passive Super Chip Module

A metal frame is described which provides three functions in conjunction with the passive super chip (PSC) module. 1. It is used to position the PSC on the signal plane

of the module pin plate.

2. It is used to mechanically hold down the PSC on

the spacer and the signal plane to prevent

vibration and floating prior to and during wire

bonding.

3. It is used to ground the PSC.

The metal frame is made of beryllium copper which is personalized by etching. The PSC module is assembled as described below (Fig. 1).

Metal frame 1 (top view Fig. 2) and passive super chip 2 assembled with chips 3 are placed in an automatic split optical assembly to position metal frame fingers 4 over the passive super chip pads for bonding. A second assembly is used to mount the assembly of metal frame 1 and passive super chip 2 on top of module pin plate 5 with spacer 6. Positioning studs and holes are used along with a fixture which merges the metal frame with pins 7, pressing it down with spring washers. A cap 8 with heat sink and grease 9 provides the required chip cooling.

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