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Ceramic Carrier for Silicon-On-Silicon Components

IP.com Disclosure Number: IPCOM000036001D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Blum, A: AUTHOR [+4]

Abstract

A ceramic carrier for silicon-on-silicon components is described which is made up of four identically structured segments 1A to 1D (Fig. 1).

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Ceramic Carrier for Silicon-On-Silicon Components

A ceramic carrier for silicon-on-silicon components is described which is made up of four identically structured segments 1A to 1D (Fig. 1).

On their outsides, the segments are provided with a raised port- ion 2 (Fig. 2) on which gold-plated I/O pads 3 are positioned. Gold- plated minicontact springs 4, provided with spherical elements, are soldered or welded to pads 3. According to the groove and tongue principle, the insides of the segments are provided with detent mechanisms 5 for carrier self-alignment during module assembly.

Logical operations are processed inside Si-chips 6 which communicate through C4 connections 7 and Si-distribution carrier 8 for this purpose. The generated I/O signals are fed to Ni/Au contact balls 9 or ramps. From Ni/Au contact balls 9, the I/O signals are fed by contact springs 4, using suitably arranged lines on the I/O carrier surface (metallized ceramic technology), to I/O pin 10, or they are transferred within the I/O carrier (multilayer ceramic technology) to the respective I/O pin 11.

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The module package assembly is obtained by using four identically structured ceramic carrier segments 1A to 1D, by placing an insulating mat 12 on their surface and by clamping Si-distribution carrier 8, fitted with chips 6, underneath the row of minicontact springs 4. Elastic insulating mat 12 may comprise a laminated metal foil 13 acting as a protection against particle radiation a...