Browse Prior Art Database

Cubic Memory Module

IP.com Disclosure Number: IPCOM000036015D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Gruber, HW: AUTHOR [+3]

Abstract

The invention described in this article allows high packing densities even in limited space systems, such as Personal System/2.

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Cubic Memory Module

The invention described in this article allows high packing densities even in limited space systems, such as Personal System/2.

Conventionally, memory cards fitted with dynamic memory chips are mounted upright to increase the packing density. In commercially available memory modules this may lead to the component height being exceeded so that adjacent card slots are blocked.

The illustrated packaging method desribed below increases the memory size, while reducing the volume required, which affords packing densities that are twice as high as those obtained by conventional packaging methods.

The cubic memory module (CUMM) used for this purpose is made up of a number of, say, five, micro memory modules consisting of ceramic carriers 1 with four soldered chips 2 each and four high-frequency decoupling capacitors 3. Mounting the chips in a separate housing, which is normally required, is eliminated by C4 soldering, for example. The micro memory modules are soldered upright to substrate 4 between two module pin rows and are mounted in a housing 5 of, say, aluminum. The pins extend into the inside of the substrate to reduce shocks and vibrations and to mechanically fix the micro modules.

If MC36 substrates are used, for example, the number of connector pins available is about three times that of standard memory modules. With plugged modules, such a great number of pins lead to increased safety, as much higher forces are required for detaching the mod...