Browse Prior Art Database

Process for Producing Lateral Chip Connectors

IP.com Disclosure Number: IPCOM000036031D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 56K

Publishing Venue

IBM

Related People

Euen, W: AUTHOR [+2]

Abstract

To reduce the space requirements of semiconductor chips, it is proposed that the chips be stacked and laterally connected to each other. For this purpose, several (say, identical storage) chips 1 are provided with an insulation layer 2 and planarized.

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Process for Producing Lateral Chip Connectors

To reduce the space requirements of semiconductor chips, it is proposed that the chips be stacked and laterally connected to each other. For this purpose, several (say, identical storage) chips 1 are provided with an insulation layer 2 and planarized.

Wirings 3 for all external lines, such as those used for voltage supply, inputs/outputs and test connectors, extend up to the chip edges. For storage chips, the relevant lines would be the voltage supply line, the address and the data bus, and the control signal line. These lines may extend up to one chip edge or several chip edges.

After chips 1 have been tested on the wafer, the latter is sawed. The individual chips 1 are placed on top of each other (to make up a, say, 8-chip package, with each chip having a data input and a data output and a 1-byte-wide data bus) (Fig. 1). The ends of wiring 3 of the chip inputs and outputs are shown at the chip edges.

Fig. 2 is a cross-sectional side view of the further manufacturing process. The conductive silicon of the chips has to be etched back. This is done without photolithography (masks) by etchants that etch wiring/metallization 3 less strongly than the silicon (Fig. 2B). Then, an oxide or nitride insulator 4 is applied (Fig. 2C). This is followed by back etching to bare the ends of wiring/metallization 3. The chip side face thus produced is ready for wiring.

The lateral connectors 5 of the chips are also produced without ph...