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Thermal Conduction Module With Integral Cold Plate Formed by a Cover Plate and a Seal

IP.com Disclosure Number: IPCOM000036046D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Hwang, UP: AUTHOR [+2]

Abstract

In a new thermal conduction module (TCM), a cold plate is formed by a top cover plate, the underlying plate of the module hat, and a seal that bridges the space between the two plates. The plates are held together by screws located outside the seal. The cover plate carries inlet and outlet fittings for connection to a supply of chilled water. The seal has a metal ring that is H shaped in section and upper and lower elastomeric rings that are each locked into a notch of the H shape and extend beyond the metal ring in a half-cylinder shape.

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Thermal Conduction Module With Integral Cold Plate Formed by a Cover Plate and a Seal

In a new thermal conduction module (TCM), a cold plate is formed by a top cover plate, the underlying plate of the module hat, and a seal that bridges the space between the two plates. The plates are held together by screws located outside the seal. The cover plate carries inlet and outlet fittings for connection to a supply of chilled water. The seal has a metal ring that is H shaped in section and upper and lower elastomeric rings that are each locked into a notch of the H shape and extend beyond the metal ring in a half-cylinder shape.

Some circuit modules have an array of semiconductor chips carried on the upper surface of a substrate, a structure called a hat that cooperates with the substrate to form an enclosure for the chips, and metal components that contact the chips and conduct heat to the hat. In some modules, channels in the hat carry chilled water which receives the heat from the chips. A barrier plate in the hat separates the chip space from the water space. The metal components for a chip may comprise a heat spreader plate that contacts the upper surface of the chip and an array of cylindrical pins that conduct heat from the spreader plate to the water. The lower end of a pin fits into a blind hole in the upper surface of the spreader plate, and the upper end of the pin extends through the barrier plate into the water space. See U.S. Patent 4,765,400.

The top cov...