Browse Prior Art Database

Direct Attachment of a Silicon Carrier for IC Chips to a Circuit Card

IP.com Disclosure Number: IPCOM000036103D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 3 page(s) / 153K

Publishing Venue

IBM

Related People

Horbach, HG: AUTHOR [+5]

Abstract

Several solutions are disclosed for directly attaching a silicon carrier for IC chips, which is also known as a passive super chip (PSC), to a circuit card, thus improving the electrical performance R, L, C.

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Direct Attachment of a Silicon Carrier for IC Chips to a Circuit Card

Several solutions are disclosed for directly attaching a silicon carrier for IC chips, which is also known as a passive super chip (PSC), to a circuit card, thus improving the electrical performance R, L, C.

According to Fig. 1, dendrites 1 on Cu pads 2 connect PSC 3 to card 4. The dendrite connections, placed in a multiple perimeter row on the PSC, afford a much higher I/O and power connectivity for the PSC than present technologies which connect only a single row of pads. In addition to the perimeter connections, further power contacts between the chips are provided, which are required for future PSCs carrying VLSI chips with more than 100,000 logic gates and high power rates, such as those produced in BICMOS technology. By these additional power connections, DC power drops are drastically reduced. In addition, signal

(Image Omitted)

connections may be provided between the chips on the PSC and the card to further improve the I/O connectivity of the PSC or to reduce the wiring complexity of the card or the PSC wiring. Particularly long critical nets on the PSC may be relocated to low-ohmic card nets.

Depending upon the height of the Cu pads, it may be necessary to use a molded card. Grooves 5 provide automatic chip protection. The card itself consists of a material with a thermal coefficient of expansion matching that of the PSC. In Fig. 1, a CERACOM* card is used, but other materials are equally ...