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Plating a Bondable Gold Layer on a Nickel Surface Using a Gold (Iii) Strike Bath

IP.com Disclosure Number: IPCOM000036107D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Schuster, U: AUTHOR

Abstract

The described process achieves a good adhesion between a nickel surface and a bondable gold layer and comprises the following steps. 1. Electrolytic (cathodic) cleaning in an alkaline solution containing 40 g/l NaOH and 15 g/l Na2CO3, voltage 5 V, time 45 to 80 seconds 2. Rinsing 3. Activating in a 10% sulphuric acid, time 60 sec. 4. Rinsing 5. Gold striking in a gold (III) bath Au content 2 g/l K AU(CN)4, pH value 0.4 - 0.6, current density 2 to 4 A/dm2, time 3 minutes 6. Rinsing 7. Gold bath for plating the bondable gold layer.

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Plating a Bondable Gold Layer on a Nickel Surface Using a Gold (Iii) Strike Bath

The described process achieves a good adhesion between a nickel surface and a bondable gold layer and comprises the following steps. 1. Electrolytic (cathodic) cleaning in an alkaline

solution containing 40 g/l NaOH and 15 g/l Na2CO3,

voltage 5 V, time 45 to 80 seconds

2. Rinsing

3. Activating in a 10% sulphuric acid, time 60 sec.

4. Rinsing

5. Gold striking in a gold (III) bath Au content 2

g/l K AU(CN)4, pH value 0.4 - 0.6, current

density 2 to 4 A/dm2, time 3 minutes

6. Rinsing

7. Gold bath for plating the bondable gold layer.

The process provides a good adhesion between nickel and gold without any gold immersion and diffusion steps.

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