Browse Prior Art Database

Ultrasonic Flux Dispenser

IP.com Disclosure Number: IPCOM000036127D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 74K

Publishing Venue

IBM

Related People

Chiavelli, R: AUTHOR [+3]

Abstract

The ultrasonic flux dispenser dispenses a .001" thick film of flux in a predetermined area, such as square or rectangular, for single chip placement. (Image Omitted)

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Ultrasonic Flux Dispenser

The ultrasonic flux dispenser dispenses a .001" thick film of flux in a predetermined area, such as square or rectangular, for single chip placement.

(Image Omitted)

A flux-dispensing system has been designed with the capability of depositing a predetermined amount of flux over a predetermined area, such as one chip site, as required in individual chip rework. The coverage of the area will be uniform to a required thickness, for example, .001 Ao .

This flux-dispensing system employs an ultrasonic liquid dispensing unit by Sono-Tek Corporation and an IBM designed air shield adapter with an optional flux pre-mixing chamber.

Figs. 1 and 2 show Flux Supply 1, Flux Thinner 2 (optional), Flux and Thinner Mixing Chamber 3, Ultrasonic Power Supply 4, Air shield 5, Air or Gas Intake 6, Flux Feeding Tube 7, Air Chamber 8, Air Curtain 9, Atomized Flux 10, Chips 11, Substrate 12, and a Sono-Tek Corp. Ultrasonic Horn 13.

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