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Micro-Clad Technique

IP.com Disclosure Number: IPCOM000036224D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Conru, AW: AUTHOR [+4]

Abstract

To prevent oxidation and assure good bonding, oxidizable metal (e.g., copper on printed circuit boards) is coated with a noble metal. However, generally only small regions of the metal need to be so coated.

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Micro-Clad Technique

To prevent oxidation and assure good bonding, oxidizable metal (e.g., copper on printed circuit boards) is coated with a noble metal. However, generally only small regions of the metal need to be so coated.

The technique is as follows. A noble metal, such as gold, in the form of a sphere is thermosonically bonded to and flattened by high pressure to the required small region of the metal to be protected. Control of the atmosphere
(i.e., reducing or non-oxidizing) during sphere formation and/or bonding permits a wide selection of metals and cladding materials.

The technique can be used for a variety of applications. One is to apply gold cladding in regions of copper lead frames which are used as future secondary copper wire bonding sites. Another useful application is to form small areas on a copper printed circuit which can be wet by solder in a wave-soldering operation.

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