Browse Prior Art Database

Stress Reliever for Single In-Line Package (Sip) Solder Joints

IP.com Disclosure Number: IPCOM000036261D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Singh, P: AUTHOR [+2]

Abstract

Disclosed is a design concept for holding a Single In-line Package (SIP) straight during wave-soldering operation. The design provides strain relief to the solder joints when operators try to straighten a bent SIP. It also provides protection against bending at subsequent assembly and test operations.

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Stress Reliever for Single In-Line Package (Sip) Solder Joints

Disclosed is a design concept for holding a Single In-line Package (SIP) straight during wave-soldering operation. The design provides strain relief to the solder joints when operators try to straighten a bent SIP. It also provides protection against bending at subsequent assembly and test operations.

The design is shown in Fig. 1. It consists of an L-shaped plastic piece with a groove to accommodate the SIP card thickness. Two pieces (same part number) are used for each SIP. A SIP with the strain reliever assembled is shown in Fig.
2.

The strain reliever is molded from a plastic that is compatible

(Image Omitted)

with assembly process temperatures and chemicals used in manufacturing.

The same concept can be extended to surface-mounted connectors where bending stresses may be induced during insertion/withdrawal and the staking of plastic anchor pins and holes in printed circuit cards is not allowed to provide strain relief.

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