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Integrated Termination TAB Structure for High Speed Devices

IP.com Disclosure Number: IPCOM000036293D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Bickford, HR: AUTHOR [+3]

Abstract

Disclosed is a method for providing integrated signal-line termination in Tape Automated Bonding (TAB) packages.

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Integrated Termination TAB Structure for High Speed Devices

Disclosed is a method for providing integrated signal-line termination in Tape Automated Bonding (TAB) packages.

In high speed circuit applications signal lines are terminated in their characteristic impedance in order to minimize signal reflections and thus improve switching speed. At present this termination is provided by discrete resistors attached to the second-level package often at points remote from the actual location of the receivers on the net. The use of discrete resistors or resistor packs also places design constraints on the system and in some cases compromises net performance.

By integrating the terminating resistor into the first-level package, the problems associated with discrete terminating resistors are avoided. In a TAB package a terminating resistor can be integrated into the module by applying a commercially available polymeric thick film resistor material between the leads of a TAB lead frame. The resistance obtained is determined by the material used and the length of TAB lead that is overlapped and the spacing between the leads (Fig. 1). In order to achieve various resistance values the geometry of the leads can be varied (Fig. 2). The polymeric thick film material can be applied by screening or stenciling on to the leads. By this method resistors of differing values can be created

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simultaneously. The resulting resistor is trimmable for application requiring hig...