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Multi-Layered Three-Dimensional Molded Circuit Boards for Use in Computers

IP.com Disclosure Number: IPCOM000036310D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Zaderej, VV: AUTHOR

Abstract

This article describes an improved design of a molded circuit board.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 53% of the total text.

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Multi-Layered Three-Dimensional Molded Circuit Boards for Use in Computers

This article describes an improved design of a molded circuit board.

Molded circuit card technology has in recent years allowed the development of plastic cards which have ribs, bosses, stand-offs and snaps molded directly into the part. An extension to this technology is to make a computer housing and the electronic board one and the same (i.e., mold the circuitry directly into the housing).

Utilizing the design disclosed herein results in a much smaller, lighter, and manufacturable computer. The approach is to design as much function into each part as possible, yet leave the necessary flexibility in each part to make it expandable and manufacturable.

The approach regarding changes to the circuit board is to mold only the circuitry which is common to all machines and is not expected to change as the product is upgraded. Examples of circuitry which could be molded include the video (video graphics array and memory), floppy controller, keyboard and mouse controller, serial port and parallel port controllers, and any "stable" support chip circuit paths. The connectors for the standard ports for a personal computer system and the bus connectors can also be considered for being molded directly into the plastic base. All processors, co-processors, basic input-output system (BIOS) and changing circuit paths will be found on a daughter or processor card which would be plugged into an option slot.

The first advantage of molding the circuitry into the base is that the whole surface may be used (11.5" x 15") as compared to the standard panel size that is currently used (11" x 13...