Browse Prior Art Database

Functional Island Attachment to Molded Card

IP.com Disclosure Number: IPCOM000036317D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Arldt, BD: AUTHOR [+2]

Abstract

A method is described for aligning and holding any surface-mountable component or module that needs to be attached to a molded circuit card.

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Functional Island Attachment to Molded Card

A method is described for aligning and holding any surface-mountable component or module that needs to be attached to a molded circuit card.

Figs. 1 and 2 show a module with one set of peripheral leads that is aligned and held in place on a molded circuit card. The alignment is controlled by both the molded-in alignment tabs and snap clips. The snap clips also hold the module in place during a solder reflow attach process. Although the figures show a module with 8 leads, it is obvious that this could be extended to many leaded devices, such as a multi-chip functional island with peripheral leads.

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