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Soluble Metals for Epoxy and Cyanate Resins

IP.com Disclosure Number: IPCOM000036351D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Boyko, CM: AUTHOR [+3]

Abstract

This disclosure describes the addition of soluble metal complexes, such as palladium acetyl acetonate (PdAcAc) to epoxies or cyanate resins. This complex provides dual catalysis both for polymerization and for subsequent metallization.

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Soluble Metals for Epoxy and Cyanate Resins

This disclosure describes the addition of soluble metal complexes, such as palladium acetyl acetonate (PdAcAc) to epoxies or cyanate resins. This complex provides dual catalysis both for polymerization and for subsequent metallization.

Catalytic seeders for electroless copper plating come in two types: surface coatings and imbedded. The imbedded are usually palladium particles or palladium-coated fillers, which are added to the epoxy dielectric. These particles are exposed by drilling, plasma, or chemical activation and tend to give non- uniform distributions. Particles also prohibit filtration necessary to manufacture light-weight prepregs.

The surface types tend to be expensive and provide continuous coverage over entire areas; hence, after pattern plating, residual seed between the circuits causes migration and shorting problems.

A soluble seed solves all of the above problems. The preferred epoxy formulation is as follows: FR-4 epoxy/phenolic type 100.0 phr

2-Methyl Imidazole (2-MI) .8 phr

PdAcAc 2.0 phr

The 2-MI/PdAcAc ratio is essential for proper dissolution and reactivity. Where more solubility was required, PdPhAc Bis(1-phenyl-1, 3- butanedionate) Palladium (II) and PdDppd Bis(1,3 diphenyl 1,3-propanedionate) Palladium (II) were prepared and used. A typical cyanate formulation is: Dicyanate resin 40.0 phr

FR-4 epoxy resin 60.0 phr

PdAcAc .6 phr

The sluggish nature of the Pd catalyst permits higher loading witho...