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Accessible Interconnect for Rack-Mounted Processor Module-To-Module Logic Signal Communication

IP.com Disclosure Number: IPCOM000036375D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 65K

Publishing Venue

IBM

Related People

Brown, GT: AUTHOR [+4]

Abstract

An accessible interconnect system provides the capability of communicating between multiple processor modules 1 and 2 which are mounted in an EIA rack 3 using user-accessible connectors and cables 4.

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Accessible Interconnect for Rack-Mounted Processor Module-To-Module Logic Signal Communication

An accessible interconnect system provides the capability of communicating between multiple processor modules 1 and 2 which are mounted in an EIA rack 3 using user-accessible connectors and cables 4.

The accessible interconnect 5 is located midway between card-on- board (COB) packages 6 and 7. The cables 8 from the upper board 9 of the lower COB package 7 exit the module 10 at the patch panel 11. These cables connect to the upper processor module 12 at the patch panel 13 on which mating connectors 5 are mounted. The cables 14 of the patch panel connectors 5 connect to the lower board 15 of the upper COB package 6. This completes the communication path between processor modules.

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The accessible interconnect cables 8 are shielded from the point that the cables exit the lower module 10 patch panel 11 to the point at which the cables enter the upper module 12. The shield provides electromagnetic radiation attenuation for the cables as they pass externally between the modules. The shield is necessary in order to pass FCC requirements. The shield consists of a braided metal casing which is grounded at the upper patch panel 11 of the lower module 10 and at the connector 5 which is mounted to the lower patch panel 13 of the upper module 12.

The accessible interconnect provides the capability of communicating between card-on-board (COB) packages of EIA rack-mounte...