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Variable Electrode Geometry in Plasma Processes

IP.com Disclosure Number: IPCOM000036389D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Bordt, H: AUTHOR [+3]

Abstract

By varying the geometry of the electrodes used in plasma processes, an increased uniformity of the applied or etched layers is obtained.

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Variable Electrode Geometry in Plasma Processes

By varying the geometry of the electrodes used in plasma processes, an increased uniformity of the applied or etched layers is obtained.

In conventional technology, the quality of the products is confined by the rigid and invariable geometry and arrangement of the electrodes.

A considerable improvement in the uniformity of layer thicknesses and etch distributions is obtained by the schematically illustrated arrangement for varying the electrode geometry. By mechanical deformation, the proposed arrangement permits an arbitrary, even asymmetrical ring- or point-type adjustment of the electrodes to the plasma process.

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