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Method for Hermetically Filling Micropores and Capillaries in Ceramics, Metals or Plastics by Hf-Plasma-Induced Polymerization of Reactive Gases

IP.com Disclosure Number: IPCOM000036401D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Butz, M: AUTHOR [+4]

Abstract

This article describes a method for the solvent-free, plasma-chemical deposition of inorganic or organic, high-temperature resistant materials on microporous solids.

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Method for Hermetically Filling Micropores and Capillaries in Ceramics, Metals or Plastics by Hf-Plasma-Induced Polymerization of Reactive Gases

This article describes a method for the solvent-free, plasma-chemical deposition of inorganic or organic, high-temperature resistant materials on microporous solids.

First Example: The substrate to be treated is placed in a vacuum chamber 1 such that after the recipient has been sealed and a vacuum been applied by pumps 4, a minimum residual pressure of 10-4 bar is obtained. Outside or inside the recipient, an arrangement is provided which comprises two electrodes 2, one of which is stationary and the other one scans the substrate 5 to be treated by means of motor M.

Through precision-dosing valves 3, gaseous monomers, such as alkyltitanates and aryldichlorosilanes, alkylsilicates, alkylborates and alkylphosphites, and the like, are fed from storage tanks to the recipient. By means of the resultant partial pressures, a particular stoichiometric ratio of the reactants 8 may be set.

The monomers are diffused into the pores and capillaries of the substrate to be treated and are subsequently made to react by waves produced in an HF or a microwave generator 6.

For the previously described capacitive electrode arrangement it is decisive that reactive species are formed only within the electrodes and that they recombine or react quickly in the capillaries, depending upon the gas flow in the recipient and the relatively small me...