Browse Prior Art Database

Tab-Soldering Fixture

IP.com Disclosure Number: IPCOM000036419D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Fink, OJ: AUTHOR [+2]

Abstract

A method is described to solder TABS on circuit boards using conventional dip-solder baths, without splattering or other surface contaminations to the surrounding areas at 500oF.

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Tab-Soldering Fixture

A method is described to solder TABS on circuit boards using conventional dip-solder baths, without splattering or other surface contaminations to the surrounding areas at 500oF.

The fixture is made of titanium to withstand the corrosive heat condition and restrict any bondage of melted solder to the fixture. In a closed position it forms a liquid tight seal around the circuit board, allowing the exposed area to be soldered and providing the easy loading and unloading of the product.

The adapter plate 4, which is connected to the rear plate 2, is attached to the lift arm of the dip-solder bath, with the front plate 1 connected to the plate 2 by both hinge blocks 5. Lifting the slide locks 3, front plate 1 opens to the 45-degree opening, permitting loading or unloading of the product.

Inside of plate 2, a cavity with the external shape of the product with the heat- resistant TEFLON* tape (held in place by a slot on both plates, front and rear) holds the product in place. By closing front plate 1 with both slide locks 3, the product is securely protected. * Trademark of E. I. du Pont de Nemours & Co.

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