Browse Prior Art Database

High Density Edge Connector

IP.com Disclosure Number: IPCOM000036451D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 3 page(s) / 99K

Publishing Venue

IBM

Related People

Beaudry, J: AUTHOR [+7]

Abstract

With increased circuit density and smaller electronic packages, it is necessary to provide new means for interconnecting the circuit cards to the boards. This disclosure describes a reliable, high density connector as a solution.

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High Density Edge Connector

With increased circuit density and smaller electronic packages, it is necessary to provide new means for interconnecting the circuit cards to the boards. This disclosure describes a reliable, high density connector as a solution.

The High Density Edge Connector is composed of a series of spring beams 1 situated in a staggered .050" grid. The springs 1 are soldered or pressed into a circuit card 2 and held in alignment by the housing 3. The palladium plated springs 1 mate with the perpendicularly arranged gold plated cylindrical pads 4 located at the front inside surface of the flex circuit carrier 5. The pads 4 are connected internally to the flex circuit wiring and terminate at the solder pads 6 situated at the base of the carrier 5. The flex carrier is surface soldered to the circuit board. A housing 7 holds the flex carrier 5 and provides the support for insertion and mating of the device.

The card contact springs 1 form a crossed cylinder contact mating with the flex carrier cylindrical pads 4. This type of contact mating arrangement is extremely effective in dust and debris penetration and provides a high Hertz stress concentration for low contact resistance.

During use, the edge connector spring housing assembly is inserted by an appropriate means into the flex circuit carrier assembly which causes the springs 1 to deflect and wipe against their appropriate pads 4. The springs 1 are situated in a staggered fashion so that the upp...