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Means of Removing More Heat From a TCM (Or Other Liquid-Cooled Logic Package) by Reducing the Coolant Temperature

IP.com Disclosure Number: IPCOM000036505D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Vasile, VC: AUTHOR

Abstract

The coolant temperature in a liquid-cooled logic package is limited to the dew point of the room air. Attempts to cool the logic to a lower temperature will cause condensation to form on the logic package and the pipes distributing the coolant throughout the machine. To eliminate this problem and allow much lower coolant temperatures, the TCM top hat, formed into a proper heat sink, can be immersed in a suitable coolant. The coolant is contained in an insulated vessel and is kept at the proper temperature by having the heat exchanger of a refrigeration unit immersed in the coolant. Circulating through the heat exchanger is a refrigerant, such as FREON*.

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Means of Removing More Heat From a TCM (Or Other Liquid-Cooled Logic Package) by Reducing the Coolant Temperature

The coolant temperature in a liquid-cooled logic package is limited to the dew point of the room air. Attempts to cool the logic to a lower temperature will cause condensation to form on the logic package and the pipes distributing the coolant throughout the machine. To eliminate this problem and allow much lower coolant temperatures, the TCM top hat, formed into a proper heat sink, can be immersed in a suitable coolant. The coolant is contained in an insulated vessel and is kept at the proper temperature by having the heat exchanger of a refrigeration unit immersed in the coolant. Circulating through the heat exchanger is a refrigerant, such as FREON*. The drawing illustrates a TCM system; however, other packaging systems, such as a planar board would work as well, with the module/chip caps, formed into a suitable heat sink, immersed into the coolant. In some cases, it will be necessary to move the coolant past the TCM or module/chip heat sinks in order to eliminate hot spots. This can be done with a pump or impeller.

This scheme can be modified for much colder temperatures where the insulated vessel is a cryostat and the coolant is liquid nitrogen.

The object is not to bring the logic to the temperature of the coolant but rather to have the coolant at the proper temperatures to remove enough heat from the heat sinks to keep the logic at its optimum...