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Browse Prior Art Database

Method to Place and Bond Surface-Mounted Components

IP.com Disclosure Number: IPCOM000036581D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Hunt, RE: AUTHOR

Abstract

An apparatus is shown in Fig. 1 for gang-placing surface-mounted technology chips on a circuit board and soldering them in place.

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Method to Place and Bond Surface-Mounted Components

An apparatus is shown in Fig. 1 for gang-placing surface-mounted technology chips on a circuit board and soldering them in place.

Fig. 1 shows a side cross-section view of the placement module generally designated as numeral 1. Module 1 is rigidly attached to fixture plate 2. Vertical component holding tube 3 with component stack 4 is mounted in module 1. Gravity plug 5 provides a normal load to prevent components from accidentally being scrambled.

Stripper bar 6 is moved horizontally by crank member 7 which is actuated by air cylinder 8 and restored by spring 9. Opposite bar 6 on module 1 is an air cylinder 10 with plunger 11 and return spring 12.

When bar 6 is moved left it strips off the bottom component 13 and places it under plunger 11 which places it on the board 14 on solder lands 15 and 16.

Fixture plate 2 contains numerous modules and, after placement, plate 2 is lifted or board 14 is lowered for transport to another station.

The advantage of this apparatus lies in its small footprint on the board. Many components can be placed and bonded in one workstation.

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