Browse Prior Art Database

Improved Apparatus to Place and Bond Surface-Mounted Components

IP.com Disclosure Number: IPCOM000036582D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Hunt, RE: AUTHOR

Abstract

An improved embodiment over the Placement Apparatus shown and described in the preceding article.

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Improved Apparatus to Place and Bond Surface-Mounted Components

An improved embodiment over the Placement Apparatus shown and described in the preceding article.

The figure shows a side cross-sectional view of the placement module generally designated as numeral 1. Module 1 is rigidly attached to fixture plate 2. Vertical component holding tube 3 with component stack 4 is mounted in module
1. Gravity plug 5 provides a normal load to prevent components from accidentally being scrambled.

Stripper bar 6 is moved horizontally by crank member 7 which is actuated by air cylinder (not shown) and restored by spring 9. Opposite bar 6 on module 1 is a vacuum tube 10 that is moved vertically by an another air cylinder (not shown).

When bar 6 is moved left it strips off the bottom component 13 and places it under vacuum tube 10 which lowers it to the board 14 on solder lands 15 and 16.

While a chip is being selected the board 14 is raised bringing solder lands 15 and 16 into contact with heating tips 17 and 18 respectively. After the solder melts the chip 13 is lowered to the board and the joint is made.

The board 14 is then lowered and tube 10 follows holding the chip 13 in place until the solder cools.

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