Browse Prior Art Database

Surface-Mounted Component Place and Bond Apparatus

IP.com Disclosure Number: IPCOM000036584D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 63K

Publishing Venue

IBM

Related People

Cook, LD: AUTHOR [+7]

Abstract

An apparatus is described for the gang placement and soldering surface mount components on a circuit board. Existing equipment and techniques use a variety of serial operations. These usually include solder screen pasting, single chip placement and reflow processes for soldering. This device does all these operations in one station. The advantages are lower capital expense, less floor space required, faster output and higher reliability.

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Surface-Mounted Component Place and Bond Apparatus

An apparatus is described for the gang placement and soldering surface mount components on a circuit board. Existing equipment and techniques use a variety of serial operations. These usually include solder screen pasting, single chip placement and reflow processes for soldering. This device does all these operations in one station. The advantages are lower capital expense, less floor space required, faster output and higher reliability.

Fig. 1 shows stations 1, 2 and 3 in a serial conveyor assembly line where electronic components are placed on card 4 as it is indexed under the stations. The components are in the vertical tubes protruding from the work stations.

Fig. 2 shows side cross-sectional view of the placement apparatus. Vertical component holding tube 3 with component stack 4 is inserted by the load operator into stationary plate 2. Gravity plug 5 provides a normal load to prevent components from accidentally being scrambled.

A shuttle plate 6 with a component holding pocket 7 is moved to the left by an air cylinder (not shown). This motion of pocket 7 strips bottom chip 8 from stack 4 and places it under vacuum tube 9 where the vacuum lifts it slightly off the shuttle plate. The shuttle plate 6 is then restored to the right under tube 3.

(Image Omitted)

Attached to the underside of plate 2 is insulator 12 and soldering iron 13. Iron 13 has protruding tips 14 and 15 corresponding to solder lands 16 and 1...