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Thermal Conduction Module With Interleaved Plates Having Variably Aligned or Non-Aligned Windows to Compensate for Variations in Chip Height

IP.com Disclosure Number: IPCOM000036642D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR [+2]

Abstract

Some circuit modules have semiconductor chips mounted in an array on a thin flat substrate that for purposes of terminology is arbitrarily positioned in a horizontal plane with the chips on the upper surface. Apparatus called a hat overlies the chips and cooperates with the substrate to form an enclosure for the chips. Metal components are spring-loaded to contact the upper surface of the chip and conduct heat from the chips to the hat. The hat is cooled with chilled water.

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Thermal Conduction Module With Interleaved Plates Having Variably Aligned or Non-Aligned Windows to Compensate for Variations in Chip Height

Some circuit modules have semiconductor chips mounted in an array on a thin flat substrate that for purposes of terminology is arbitrarily positioned in a horizontal plane with the chips on the upper surface. Apparatus called a hat overlies the chips and cooperates with the substrate to form an enclosure for the chips. Metal components are spring-loaded to contact the upper surface of the chip and conduct heat from the chips to the hat. The hat is cooled with chilled water.

In some modules, the metal components are formed partly by two sets of plates interleaved in vertical plates. Half of the plates (the lower set) are attached at their lower edges to a metal plate that contacts the upper surface of the chip. The other plates (the upper plates) have their upper edges attached to the hat. The upper and lower plates are in close contact for heat transfer, but the lower plates are free to move to adjust to chips that are at different heights. See U.S. Patent 4,498,530.

For a chip at a minimum height (farthest from the hat), the plates present a maximum thermal resistance because the thermal path is longer and the overlap of the plates is reduced. Conversely, for a chip at a maximum height, the plates present a minimum thermal resistance. Variations in chip height occur randomly and are not related to the cooling needs of a chi...