Browse Prior Art Database

Zero Insertion Force Contact System

IP.com Disclosure Number: IPCOM000036650D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 63K

Publishing Venue

IBM

Related People

Landrock, J: AUTHOR [+3]

Abstract

The contact system illustrated in the figures consists of a contact spring housing 1 with two contact spring combs 2 of a non-conductive material. The faces of contact spring combs 2 are fitted with the individual zero insertion force (ZIF) contact springs 3. Contact spring combs 2 are connected by an axis 4, guided in slots 5, and are (Image Omitted) forced upwards by actuator springs 6, so that the contact system is open in this state. Spring separators 7, preventing shorts to contact springs 3, are arranged between the individual contact springs 3. These springs are made of CuBe and are gold-plated in the contact regions.

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Zero Insertion Force Contact System

The contact system illustrated in the figures consists of a contact spring housing 1 with two contact spring combs 2 of a non-conductive material. The faces of contact spring combs 2 are fitted with the individual zero insertion force (ZIF) contact springs 3. Contact spring combs 2 are connected by an axis 4, guided in slots 5, and are

(Image Omitted)

forced upwards by actuator springs 6, so that the contact system is open in this state. Spring separators 7, preventing shorts to contact springs 3, are arranged between the individual contact springs 3. These springs are made of CuBe and are gold-plated in the contact regions.

Wipe ramps 8, increasing the contact pressure upon contact and cleaning gold-plated or palladinized card or board taps 9 and 10 by contact wiping, are provided in the arcuate portion of the contact springs. Dust-sealing washers 11, sealing the contact faces and protecting them against contamination, are positioned at the board interface and the card insertion slot of the contact spring housing. The contact spring housing assembly is fixed to printed circuit board 13 by retention clips 12. During this process, the contact spring comes to rest at a bias against the associated board tab 10.

As printed circuit card 14 is inserted, its lower edge forces the contact spring comb against the spring pressure in the direction of the board. As a result, the contact spring is forced against board tab 10, wiping the lat...