Browse Prior Art Database

Self-Aligning Memory Module

IP.com Disclosure Number: IPCOM000036720D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 81K

Publishing Venue

IBM

Related People

Beaman, B: AUTHOR

Abstract

The self-aligning memory module (SAMM) is a first level integrated circuit package that is uniquely suited for packaging memory devices such as DRAMs and SRAMs due to the large rectangular wafer size and the small number of input/output connections that are characteristic of these devices. The advantage of the SAMM package compared to conventional plastic packages used for memory devices (PDIP, SOP, SOJ, and ZIP) is the increase in packaging density due to the edge-mount configuration with surface-mounted, fine-pitch lead spacing. The self- aligning feature improves the accuracy of aligning the fine pitch leads with the circuitry on the printed circuit board using conventional pick and place equipment.

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Self-Aligning Memory Module

The self-aligning memory module (SAMM) is a first level integrated circuit package that is uniquely suited for packaging memory devices such as DRAMs and SRAMs due to the large rectangular wafer size and the small number of input/output connections that are characteristic of these devices. The advantage of the SAMM package compared to conventional plastic packages used for memory devices (PDIP, SOP, SOJ, and ZIP) is the increase in packaging density due to the edge-mount configuration with surface-mounted, fine-pitch lead spacing. The self- aligning feature improves the accuracy of aligning the fine pitch leads with the circuitry on the printed circuit board using conventional pick and place equipment. Also, the adjustable angle mounting feature provides the flexibility to optimize the overall package height to suit the constraints of a given application.

The disclosed package includes the following key elements: memory device 1, polyimide tape 2, lead frame 3, wire bonds 4, molded plastic body 5, alignment dowels 6, and alignment holes 7. Fig. 1 shows the detailed construction of the package, and Fig. 2 shows the self-align

(Image Omitted)

ing feature of the package. Two dowels on the back side of the plastic package are mated with the holes on the front side of an adjacent package to align the module leads with the solder pads on the printed circuit board and provide mechanical stability for mounting the modules. The mounting angle o...