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Ceramic Substrate Reclamation Process

IP.com Disclosure Number: IPCOM000036751D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Carhart, RA: AUTHOR [+4]

Abstract

Metallized ceramic substrates, having defective metal conductors on a dielectric of glass, polyimide or aluminum trioxide and connected by vias with an underlying metal ground or voltage plane, can be reclaimed by first protecting the vias, then etching off the top metal layer and reconstructing the removed conductors.

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Ceramic Substrate Reclamation Process

Metallized ceramic substrates, having defective metal conductors on a dielectric of glass, polyimide or aluminum trioxide and connected by vias with an underlying metal ground or voltage plane, can be reclaimed by first protecting the vias, then etching off the top metal layer and reconstructing the removed conductors.

When defects, such as short or open circuits, are found on the top metal layer of ceramic substrates, the via connections are protected by either exposed and developed photoresist or screened ink. The remaining unprotected chrome- copper-chrome conductors, are then removed with known etchants. Next, the protective layer on the via connections is stripped and their chrome top coatings etched. After precleaning and a Bright dip, new top surface metal conductors can be added to the substrate.

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