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Optical and Sub-Optical Imaging Technique Using Optical Imaging

IP.com Disclosure Number: IPCOM000036805D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 57K

Publishing Venue

IBM

Related People

Cronin, JE: AUTHOR [+2]

Abstract

A technique is shown for producing an optical and/or sub-optical semiconductor image through the utilization of a incompletely defined image as the optical or sub-optical image.

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Optical and Sub-Optical Imaging Technique Using Optical Imaging

A technique is shown for producing an optical and/or sub-optical semiconductor image through the utilization of a incompletely defined image as the optical or sub-optical image.

Producing ever smaller image sizes is a fundamental goal for VLSI. Because these images are approaching sizes that optical means cannot resolve, a need has developed for methods of using conventional optics to produce both optical and sub-optical images. In general, sub-optical images are seen routinely when an image, smaller than the minimum feature size, is exposed and developed. These sub-optical images are partially defined in the resist simultaneously with fully defined optical images formed and are produced by a combination of incomplete exposure and development. However, to extend the process parameters to completely define the optical and sub-optical images would render all other images unusable, i.e., standard image size and shape degrade.

Optical and sub-optical images are formed by the following method: A. An imageable material is deposited over a material to be patterned. The imageable material is generally a type of photoresist that can produce partially defined sub- optical images after being exposed and developed, as shown in Fig. 1. All combinations of image sizes, optical and sub-optical, are formed in the imageable material, and the size of the sub-optical images depends on the minimum sub-optical image that...