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Improved Process for Incorporation of Metal Pattern (Circuitry) Decals Into Multi-Layer Ceramic Substrates

IP.com Disclosure Number: IPCOM000036851D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 13K

Publishing Venue

IBM

Related People

Acocella, J: AUTHOR [+3]

Abstract

This article concerns an improved means for incorporating solid metal line patterns (circuits) into existing multi-layer ceramic (MLC) substrate manufacturing processes.

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This is the abbreviated version, containing approximately 55% of the total text.

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Improved Process for Incorporation of Metal Pattern (Circuitry) Decals Into Multi-Layer Ceramic Substrates

This article concerns an improved means for incorporating solid metal line patterns (circuits) into existing multi-layer ceramic (MLC) substrate manufacturing processes.

Existing procedures for transferring a decal-like, fine-line, metal circuit pattern from a carrier to a "green" laminate involve the use of heat and pressure in a lamination press and contribute to the lack of a complete metal line enclosure in the fired laminate. An alternative technique is to cast the green ceramic slurry onto and about the metallization pattern. However, both gaps or voids found along the edges of the metal line parallel to the direction of applied pressure and significant shear stresses are noted to arise during the processes, leading to line pattern distortion and/or breakage.

The disclosed procedure avoids these problems by:

1) providing more uniform glass-ceramic particle

packing along circuit patterns which yields complete

metal enclosure within the fired ceramic,

2) eliminating shear stresses during the transfer of

the metal pattern decal into the green sheet or

laminate. This is accomplished by employing the

developed decal metallurgy on its carrier as the

carrier for the formation of greensheets or laminates.

The (modified) MLC slurry is sprayed directly onto the

decal/carrier. Greensheet/decals of 1.5 to 6.0 mils

thickness can be made with this process.

The disclosed process provides for:

1) the desired uniform packing of particles around

solid metal feat...